First, SMT process ------ single-sided assembly process
Incoming material inspection --> Screen printing solder paste (point patch adhesive) --> patch --> drying (curing ) --> reflow soldering --> cleaning --> inspection --> repair
Second, SMT process ------ single-sided mixing process
Incoming material inspection --> PCB A side silk screen solder paste (point patch glue) --> patch --> drying (curing) --> reflow soldering --> cleaning --> plug --> wave soldering --> Cleaning --> Inspection --> Rework
Third, SMT process ------ double-sided assembly process
A: incoming material inspection --> PCB A side silk screen solder paste (point patch glue) --> patch --> drying (curing) --> A surface reflow soldering --> cleaning --> flap --> PCB B-side silk screen solder paste (point paste glue) --> Patch --> Drying --> reflow soldering (preferably only for B side --> cleaning --> detection --> repair This process is suitable for use when a large SMD such as PLCC is attached to both sides of the PCB.
B: Incoming material inspection --> PCB A-side silk screen solder paste (point patch glue) --> Patch --> Drying (curing) --> A surface reflow soldering --> Cleaning --> Flip --> PCB B-side patch adhesive --> Patch --> Curing --> B-face wave soldering --> Cleaning --> Inspection --> Rework ) This process is suitable for PCB A surface reflow Welding, B-side wave soldering.
Гэты працэс трэба выкарыстоўваць у SMD, сабраных на баку B друкаванай платы, толькі калі кантакты SOT або SOIC (28) ніжэй.
Fourth, SMT process ------ double-sided mixing process
A: incoming inspection --> PCB B-side patch adhesive --> patch --> curing --> flap --> PCB A side plug --> wave solder --> cleaning --> Detection --> Rework and post-insertion, suitable for SMD components more than separate components
B: incoming material inspection --> PCB A side plug-in (pin bending) --> flap --> PCB B-side point patch glue --> patch --> curing --> flap - -> Wave soldering --> cleaning --> inspection --> repair
ВЫБІРАЙ І МЕСЦАЙ МАШЫНУ - ПРАФЕСІЙНАЯ ДЛЯ святлодыёднага дысплея, ёмістасць дасягненні 150000 за гадзіну
Час публікацыі: верасень-03-2020